Reid, Jason S.

Combined from CaltechAUTHORS

• Akagi, S. K. and Yokelson, R. J., el al. (2011) Emission factors for open and domestic biomass burning for use in atmospheric models; Atmospheric Chemistry and Physics; Vol. 11; No. 9; 4039-4072; 10.5194/acp-11-4039-2011
• Reid, J. S. and Kolawa, E., el al. (1996) Amorphous (Mo, Ta, or W)–Si–N diffusion barriers for Al metallizations; Journal of Applied Physics; Vol. 79; No. 2; 1109-1117; 10.1063/1.360909
• Dauksher, W. J. and Resnick, D. J., el al. (1995) Method for fabricating a low stress x-ray mask using annealable amorphous refractory compounds; Journal of Vacuum Science and Technology B; Vol. 13; No. 6; 3103-3108; 10.1116/1.588331
• McLane, G. F. and Casas, L., el al. (1994) Reactive ion etching of Ta–Si–N diffusion barriers in CF_(4)+O_(2); Journal of Vacuum Science and Technology B; Vol. 12; No. 4; 2352-2355; 10.1116/1.587763
• Kolawa, Elizabeth A. and Reid, J. S., el al. (1993) Amorphous metallic alloys: a new advance in thin-film diffusion barriers for copper metallization; ISBN 9780819410030; Submicrometer Metallization: Challenges, Opportunities, and Limitations; 11-17; 10.1117/12.145460
• Pokela, P. J. and Reid, J. S., el al. (1991) Thermal oxidation of amorphous ternary Ta36Si14N50 thin films; Journal of Applied Physics; Vol. 70; No. 5; 2828-2832; 10.1063/1.349345
• Kolawa, E. and Chen, J. S., el al. (1991) Tantalum-based diffusion barriers in Si/Cu VLSI metallizations; Journal of Applied Physics; Vol. 70; No. 3; 1369-1373; 10.1063/1.349594