Division of Engineering and Applied Science (EAS)

(EAS)

Book

Sections from CaltechAUTHORS

• Sleeman, Michael K.; Lakebrink, Matthew T.; et al. (2026) Simulation of K-Type and H-Type Transition Using the Nonlinear One-Way Navier-Stokes Approach; ISBN 9789819698288; Proceedings of the 10th IUTAM Symposium on Laminar-Turbulent Transition; Springer Nature Singapore: Singapore; 143-149; 10.1007/978-981-96-9829-5_19
• Acosta, Alex R.; Davis, Branson W.; et al. (2025) Experimental Investigation of the Unsteadiness Boundary of Supersonic Flow Over Double Cones; ISBN 978-981-96-4766-8; Proceedings of the 34th International Symposium on Shock Waves, Volume 1: Fundamentals; 239-250; 10.1007/978-981-96-4767-5_21
• Wang, Frederic and Tamir, Jonathan I. (2025) Non-Rigid Motion Correction for MRI Reconstruction via Coarse-to-Fine Diffusion Models; ISBN 979-8-3315-2379-4; 2025 IEEE International Conference on Image Processing (ICIP); 1061-1066; 10.1109/icip55913.2025.11084510
• Graebener, Josefine B.; Incer, Inigo; et al. (2025) A Compositional Approach to Diagnosing Faults in Cyber-Physical Systems; ISBN 978-3-032-05434-0; Runtime Verification; Springer Nature Switzerland; Lecture Notes in Computer Science; Vol. 16087; 438-456; 10.1007/978-3-032-05435-7_24
• Jiang, Alexandra Zhang; Ta, Jonathan; et al. (2025) IceSpy: Reconfigurable Edge Accelerator for Scalable and Private Structural Health Monitoring; ISBN 979-8-3315-0281-2; 2025 IEEE 33rd Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM); IEEE: Piscataway, NJ; 198-207; 10.1109/FCCM62733.2025.00066
• Shapero, Aubrey; Liu, Yang; et al. (2016) Parylene-on-oil packaging for implantable pressure sensors; ISBN 978-1-5090-1973-1; 29th International Conference on Micro Electro Mechanical Systems (MEMS), 2016; IEEE: Piscataway, NJ; 403-406; 10.1109/MEMSYS.2016.7421646
• Desai, Amish; Bökenkamp, Dirk; et al. (1997) Microfluidic sub-millisecond mixers for the study of chemical reaction kinetics; ISBN 0-7803-3829-4; Transducers ’97: Digest of Technical Papers; IEEE: Piscataway, NJ; 167-170; 10.1109/SENSOR.1997.613609