<h1>Reid, Jason S.</h1>
<h2>Book Chapter from <a href="https://authors.library.caltech.edu">CaltechAUTHORS</a></h2>
<ul>
<li>Kolawa, Elizabeth A. and Reid, J. S., el al. (1993) <a href="https://resolver.caltech.edu/CaltechAUTHORS:20170912-111525959">Amorphous metallic alloys: a new advance in thin-film diffusion barriers for copper metallization</a>; ISBN 9780819410030; Submicrometer Metallization: Challenges, Opportunities, and Limitations; 11-17; <a href="https://doi.org/10.1117/12.145460">10.1117/12.145460</a></li>
</ul>