@inbook{https://resolver.caltech.edu/CaltechAUTHORS:20170912-111525959,
    title = "Submicrometer Metallization: Challenges, Opportunities, and Limitations",
    chapter = "Amorphous metallic alloys: a new advance in thin-film diffusion barriers for copper metallization",
    url = "https://resolver.caltech.edu/CaltechAUTHORS:20170912-111525959",
    id = "record",
    isbn = "9780819410030",
    doi = "10.1117/12.145460"
}